Wednesday, 9 October 2013

HP0-086 HP BladeSystem p-Class Solutions I


QUESTION 1
Which hardware components are provided to the individual server blades by the HP BladeSystem
infrastructure? (Select three.)

A. processors
B. host bus adapters
C. network interconnects
D. disk drives
E. power supplies
F. SAN interconnects
G. network interface controllers

Answer: C,E,F


QUESTION 2
What is the maximum number of server blade enclosures that can be connected to a mini bus
bar?

A. 3
B. 8
C. 4
D. 5
E. 2

Answer: A


QUESTION 3
Which HP SIM plug-in component enables proactive monitoring of server blade performance and
alerting of impending bottlenecks?

A. PIM
B. PMP
C. VMM
D. VPM

Answer: B


QUESTION 4
What is the maximum combination of power and enhanced server blade enclosures that can be
connected to a mini bus bar?

A. 2 power and 3 server blade enclosures
B. 1 power and 2 server blade enclosures
C. 2 power and 2 server blade enclosures
D. 1 power and 3 server blade enclosures

Answer: A


QUESTION 5
What was the primary reason for the introduction of the enhanced ProLiant BL p-Class server
blade enclosure?

A. increased network connectivity requirements of the half-height server blades
B. increased SAN connectivity requirements of the half-height server blades
C. increased power requirements of the half-height server blades
D. increased cooling requirements of the half-height server blades

Answer: C


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